Agglomarated Diamond for Silicon Wafer,sapphire

Agglomerated diamond powder is a new type of abrasive formed from high-quality diamond powder as raw material and

processed through special processes, with spherical particles, ability to maintain high grinding force during grinding.

(1)Size(customized micron size available upon the request):

*After Agglomarated Micron：20-30μm, 30-40μm, 40-50μm etc.

*Original Micron Size: 0.5 μm, 1.5μm,3μm etc.

(2)Application：

Abrasives for slurry applied on silicon wafer, sapphire, advanced ceramics and other hard and crisp materials.

(3)Features:

*HIGH GRINDING FORCE

Tens of thousands of cutting edges, with less and big cutting edge, each diamond ball has countless cutting points on the surface, countless micro-cracks greatly increases the grinding force.

*STRONG SELF-SHARPNESS

Since the strength of the bond bridge is much lower than the strength between the diamond C-C bonds, the diamond will fall off when grinding to avoid scratches.

*EXCELLENT WEAR RESISTANCE